Reducing board blistering, warp, and washboarding
Several areas of process control using infrared energy emitters are beneficial. Controlling cross direction (CD) moisture profiles and increasing adhesives solids at the glue line are two. Controlling these variables could result in reduced board blistering, warp, and washboarding. These are major problems directly impacting board quality. Controlling these key variables with the use of infrared energy emitters would reduce waste. With regard to conditioning, infrared energy emitters being noncontact, will impact paper moisture less as compared to conventional contact heating. This will have a positive effect on runnability and bondability.